Semiconductor Packaging Materials Lead Frame
RC250311
Develop molds based on product drawings provided by customers to meet drawing tolerance requirements,customized according to drawings.
Semiconductor packaging material lead frame is a key component made of metal to support and connect semiconductor chips. It is mainly composed of chip pads and pins extending outward, and plays important functions such as circuit connection, mechanical support, chip protection and heat dissipation, ensuring that semiconductor devices can work stably and reliably after packaging.
